Report of IC PACKAGING TECHNOLOGY EXPO

We exhibited N-VISPER310CL for 10th IC PACKAGING TECHNOLOGY EXPO (inside NEPCON WORLD JAPAN) on 28-30 January in Tokyo, Japan.
We appreciate to everybody who comes to see the VISPER.

We are always interested in suggestions that would allow us to improve upon our goods and services, and encourage you to give us your thoughts and comments.

We hope you will continue to patronize us.